For gamers, the MediaTek HyperEngine 5.0 technology delivers AI-based Variable Rate Shading (VRS) for power savings, CPU and GPU smart resource optimization for better battery life, and other upgrades for smooth gameplay. The chipset also integrates a powerful Arm Mali-G610 GPU that supports fast response times and sustains high frame rates.
Utilizing MediaTek’s Imagiq 765 and a 14-bit HDR-ISP, the Dimensity 7200 supports 200MP main cameras for epic photography. The chipset enables impressive video capturing with 4K HDR video, and even allows users to simultaneously capture content from two cameras at Full HD resolution while keeping everything in focus with all-pixel autofocus technology. To ensure users can capture stunning imagery at night and in low-light environments, the chipset has built-in motion-compensated noise reduction. Additionally, the APU supports powerful AI-Camera enhancements such as real-time portrait beautification.
Dimensity 7200 has a 3GPP Release-16 standard Sub-6GHz 5G modem with up to 4.7Gbps downlink, and supports triband Wi-Fi 6E connectivity and next-gen Bluetooth 5.3. The fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite ensure best-in-class cellular power efficiency. For reliable coverage everywhere, the chipset supports 2CC Carrier Aggregation and Dual 5G SIM with dual VoNR. The Dual SIM capability also lets users have two connections, making it easy to take work and personal calls from a single smartphone.
Additional features of the Dimensity 7200 include:
- Up to 6400Mbps memory frequency and UFS 3.1 for maximum storage.
- MediaTek MiraVision Display with HDR supports the latest standards including HDR10+, CUVA HDR, and Dolby HDR.
- Up to Full HD+ and 144Hz for brilliant displays.
- AI SDR-to-HDR video playback for enhanced multimedia experiences.
- Bluetooth LE Audio technology and Dual-Link True Wireless Stereo Audio for wireless earbud support.
Dimensity 7200 will power 5G devices launching in the global market in Q1 2023.
Alldocube has teased on Weibo an upcoming Android tablet from the brand dubbed Alldocube X Pad. The teaser unveils that the device will be based on a MediaTek Dimensity 900 chipset. This chip houses a 2.4GHz octa-core CPU and a Mali-G68 GPU. It supports LPDDR5 RAM, UFS 3.1 storage, up to 120Hz displays, dual 5G connectivity, and Wi-Fi 6. As for the tablet, the teaser also mentions 256GB of built-in storage. No…
16 February 2023
MediaTek Helio G36 is a new 12nm entry-level chipset that resembles a lot the Helio G37. The only difference is the octa-core Cortex-A53 CPU which is slightly downclocked and on the Helio G36 ticks at 2.2GHz, while on the Helio G37, it works at 2.3GHz. The GPU is the same IMG PowerVR GE8320 unit clocked at 680 MHz. The Helio G36 enables bigger camera, faster displays, MediaTek HyperEngine 2.0 Lite gaming technology…
14 February 2023
MediaTek has just announced its Dimensity 9200 chipset. It is based on TSMC’s second-generation 4nm process that integrates 17 billion transistors. The new chip also uses the second-generation ArmV9 architecture with a pure 64-bit large-core CPU. It is the first chip to integrate the Immortalis-G715 Hardware Ray Tracing GPU and the first to be Wi-Fi 7 ready. Dimensity 9200 works with LPDDR5X RAM with 8533 Mbps…
8 November 2022
MediaTek has presented its latest mid-range chipset, which comes to succeed the Dimensity 920 – the Dimensity 1080. Compared to its predecessor, the new chip is capable of supporting cameras with larger resolutions – 200MP against 108MP. There’s also a minor increase in CPU clock speed with the two big cores being clocked to 2.6GHz. All the rest remains the same as on the Dimensity 920, including the 6nm production…
11 October 2022
The Xiaomi 12 Pro Dimensity Edition has been unveiled after Xiaomi received plenty of requests for adding a Dimensity model to its Xiaomi 12 series. Hence the 12 Pro DImensity Edition appeared based on a MediaTek Dimensity 9000+ chipset with which the device has achieved 1M+ score on AnTuTU. This smartphone has a 6.73″ 2K AMOLED LTPO 2.0 display with VRR from 1 Hz to 120Hz. The camera department of this model…
4 July 2022
MediaTek today announced the Dimensity 9000+, an enhancement to the company’s top-of-the-line 5G smartphone chipset. This new high-end offering delivers a boost in performance over the Dimensity 9000 to make the next generation of flagship smartphones even more powerful and efficient. The new Dimensity 9000+ system-on-chip (SoC) integrates Arm’s v9 CPU architecture with a 4nm octa-core process, combining one…
22 June 2022
Today MediaTek unveiled a trio of chipsets for mobile devices. The most interesting is the MediaTek Dimensity 1050 which is the first solution by the brand to support mmWave (FR2) 5G connectivity in addition to the Sub-6GZ (FR1) one. The chipset is based on the TSMC’s 6nm production node and has an octa-core CPU with two Cortex-A78 cores clocked at 2.5GHz and six Cortex-A55 cores clocked at 2GHz. It is paired with a…
23 May 2022
MediaTek unveiled another chipset dubbed Dimensity 1300. Just like its predecessor – the Dimensity 1200, the new product is based on TSMC’s 6nm production node but offers increased performance. The CPU comprises a single 3GHz Cortex-A78 ultra-core, three 2.6GHz Cortex-A78 super-cores, and four 2GHz Cortex-A55 efficiency cores. The graphics department is handled by a 9-core Mali-G77 GPU. The Dimensity 1300 arrives…
2 March 2022
MediaTek has unveiled a pair of new system-on-chips for mobile devices – the Dimensity 8100 and Dimensity 8000. Both are based on TSMC’s 5nm process and feature octa-core CPUs with four A78 big cores and four A55 power-efficient cores. On the Dimensity 8100 the A78 cores are closed at 2.85GHz, while on the Dimensity 8000 they are clocked at 2.75GHz. The A55 cores on both chipsets are clocked at 2GHz. Also both use a…
1 March 2022
The latest research from Counterpoint shows that the global smartphone chipset shipments have increased by 6% YoY in Q3 2021. 5G smartphone chipset shipments grew almost two-fold for the same period. MediaTek continues to be the market leader with a 40% share in Q3 2021 and a 7% increase YoY. Its position is backed by continued strong demand in 4G SoCs and competitively priced 5G ones. Qualcomm is second with a27%…
16 December 2021
MediaTek today launched its Dimensity 9000 5G smartphone chip for next-generation flagship smartphones and announced device maker adoption and endorsements from some of the world’s biggest smartphone brands, including OPPO, vivo, Xiaomi, and Honor. The first Dimensity 9000 powered flagship smartphones will be in the market in the first quarter of next year. Dimensity 9000 integrates the cutting-edge Armv9 CPU…
16 December 2021
The MediaTek Dimensity 9000 leads the industry by embracing leading-edge TSMC N4 (4nm-class) production – the most advanced and power-efficient chip-making process ever. The Dimensity 9000 uses new Armv9 architecture CPUs to deliver unparalleled performance. Its octa-core CPU includes an Arm Cortex-X2 that bursts to epic 3.05GHz, while new LPDDR5X memory makes data immediately available, eliminating the wait to give…
19 November 2021
The Realme V11s 5G has been unveiled today for the China market. The device is based on a MediaTek Dimensity 810 chipset that ensures 5G connectivity. It offers a 2.4GHz octa-core CPU and a dual-core Mali-G57 GPU. There are 4GB or 6GB of RAM onboard and 128GB of storage that can be expanded via a dedicated microSD card slot. A 5000 mAh battery powers the smartphone and supports 18W fast charging. The camera…
24 September 2021
MediaTek today announced its new Kompanio 900T chipset, expanding MediaTek’s portfolio of mobile computing solutions for tablets, portable notebooks and other devices. The introduction of Kompanio 900T follows MediaTek’s recent launch of Kompanio 1300T, which is designed for premium tablets. MediaTek’s Kompanio platform combines powerful computing capabilities and ultra-low power consumption with the company’s…
9 September 2021
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